Invert operations using sensing circuitry

ABSTRACT

The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry includes a plurality of sensing components coupled to a controller. The controller is configured to selectively activate a first control line and a second control line to invert signals stored on a latch.

PRIORITY INFORMATION

This application is a Continuation of U.S. application Ser. No.15/810,430, filed Nov. 13, 2017, which issues as U.S. Pat. No.10,134,453 on Nov. 20, 2018, which is a Continuation of U.S. applicationSer. No. 15/132,929, filed Apr. 19, 2016, which issued as U.S. Pat. No.9,818,459 on Nov. 14, 2017, the contents of which are included herein byreference.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memory andmethods, and more particularly, to apparatuses and methods related toperforming invert operations using sensing circuitry.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic systems. There aremany different types of memory including volatile and non-volatilememory. Volatile memory can require power to maintain its data (e.g.,host data, error data, etc.) and includes random access memory (RAM),dynamic random access memory (DRAM), static random access memory (SRAM),synchronous dynamic random access memory (SDRAM), and thyristor randomaccess memory (TRAM), among others. Non-volatile memory can providepersistent data by retaining stored data when not powered and caninclude NAND flash memory, NOR flash memory, and resistance variablememory such as phase change random access memory (PCRAM), resistiverandom access memory (RRAM), and magnetoresistive random access memory(MRAM), such as spin torque transfer random access memory (STT RAM),among others.

Electronic systems often include a number of processing resources (e.g.,one or more processors), which may retrieve and execute instructions andstore the results of the executed instructions to a suitable location. Aprocessor can comprise a number of functional units such as arithmeticlogic unit (ALU) circuitry, floating point unit (FPU) circuitry, and/ora combinatorial logic block, for example, which can be used to executeinstructions by performing logical operations such as AND, OR, NOT,NAND, NOR, and XOR, and invert (e.g., inversion) logical operations ondata (e.g., one or more operands). For example, functional unitcircuitry (FUC) may be used to perform arithmetic operations such asaddition, subtraction, multiplication, and/or division on operands via anumber of logical operations.

A number of components in an electronic system may be involved inproviding instructions to the FUC for execution. The instructions may begenerated, for instance, by a processing resource such as a controllerand/or host processor. Data (e.g., the operands on which theinstructions will be executed) may be stored in a memory array that isaccessible by the FUC. The instructions and/or data may be retrievedfrom the memory array and sequenced and/or buffered before the FUCbegins to execute instructions on the data. Furthermore, as differenttypes of operations may be executed in one or multiple clock cyclesthrough the FUC, intermediate results of the instructions and/or datamay also be sequenced and/or buffered.

In many instances, the processing resources (e.g., processor and/orassociated FUC) may be external to the memory array, and data isaccessed via a bus between the processing resources and the memory arrayto execute a set of instructions. Processing performance may be improvedin a processing-in-memory (PIM) device, in which a processor may beimplemented internal and/or near to a memory (e.g., directly on a samechip as the memory array), which may conserve time and power inprocessing. However, such PIM devices may have various drawbacks such asan increased chip size. Moreover, such PIM devices may still consumeundesirable amounts of power in association with performing logicaloperations (e.g., compute functions).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an apparatus in the form of a computingsystem including a memory device in accordance with a number ofembodiments of the present disclosure.

FIG. 2A is a schematic diagram illustrating memory cells and sensingcircuitry in accordance with a number of embodiments of the presentdisclosure.

FIG. 2B is a schematic diagram illustrating a portion of sensingcircuitry in accordance with a number of embodiments of the presentdisclosure.

FIG. 3 illustrates a timing diagram associated with performing a numberof logical operations using sensing circuitry in accordance with anumber of embodiments of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes apparatuses and methods related toperforming logical operations using sensing circuitry. An exampleapparatus comprises an array of memory cells and sensing circuitrycoupled to the array. The sensing circuitry includes a plurality ofsensing components coupled to a controller. The controller is configuredto selectively activate a first control line and a second control lineto invert signals stored on a latch

Sensing circuitry can include a number of transistors, such as a pair ofisolation transistors coupled to an isolation control line and a pair ofinvert transistors coupled to an invert control line. The isolationtransistors and the invert transistors can be configured to invertsignals that are stored in a latch. The latch can be a sense amp latchand the signals can be inverted by the isolation transistors and inverttransistors when a sense amp latch is in the latched state.

A number of embodiments of the present disclosure can provide improvedparallelism and/or reduced power consumption in association withperforming compute functions as compared to previous systems such asprevious PIM systems and systems having an external processor (e.g., aprocessing resource located external from a memory array, such as on aseparate integrated circuit chip). For instance, a number of embodimentscan provide for performing fully complete compute functions such asinteger add, subtract, multiply, divide, and CAM (content addressablememory) functions without transferring data out of the memory array andsensing circuitry via a bus (e.g., data bus, address bus, control bus),for instance. Such compute functions can involve performing a number oflogical operations (e.g., logical functions such as AND, OR, NOT, NOR,NAND, XOR, etc.). However, embodiments are not limited to theseexamples. For instance, performing logical operations can includeperforming a number of non-Boolean logic operations such as copy,compare, destroy, etc.

In previous approaches, data may be transferred from the array andsensing circuitry (e.g., via a bus comprising input/output (I/O) lines)to a processing resource such as a processor, microprocessor, and/orcompute engine, which may comprise ALU circuitry and/or other functionalunit circuitry configured to perform the appropriate logical operations.However, transferring data from a memory array and sensing circuitry tosuch processing resource(s) can involve significant power consumption.Even if the processing resource is located on a same chip as the memoryarray, significant power can be consumed in moving data out of the arrayto the compute circuitry, which can involve performing a sense line(which may be referred to herein as a digit line or data line) addressaccess (e.g., firing of a column decode signal) in order to transferdata from sense lines onto I/O lines (e.g., local I/O lines), moving thedata to the array periphery, and providing the data to the computefunction.

Furthermore, the circuitry of the processing resource(s) (e.g., computeengine) may not conform to pitch rules associated with a memory array.For example, the cells of a memory array may have a 4F² or 6F² cellsize, where “F” is a feature size corresponding to the cells. As such,the devices (e.g., logic gates) associated with ALU circuitry ofprevious PIM systems may not be capable of being formed on pitch withthe memory cells, which can affect chip size and/or memory density, forexample. A number of embodiments of the present disclosure includesensing circuitry formed on pitch with memory cells of the array andcapable of performing invert functions such as those described hereinbelow.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how one or more embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure. As used herein, the designator “N,”particularly with respect to reference numerals in the drawings,indicates that a number of the particular feature so designated can beincluded. As used herein, “a number of” a particular thing can refer toone or more of such things (e.g., a number of memory arrays can refer toone or more memory arrays).

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 206 may referenceelement “06” in FIG. 2, and a similar element may be referenced as 606in FIG. 6. As will be appreciated, elements shown in the variousembodiments herein can be added, exchanged, and/or eliminated so as toprovide a number of additional embodiments of the present disclosure. Inaddition, as will be appreciated, the proportion and the relative scaleof the elements provided in the figures are intended to illustratecertain embodiments of the present invention, and should not be taken ina limiting sense.

FIG. 1 is a block diagram of an apparatus in the form of a computingsystem 100 including a memory device 120 in accordance with a number ofembodiments of the present disclosure. As used herein, a memory device120, a memory array 130, and/or sensing circuitry 150 might also beseparately considered an “apparatus.”

System 100 includes a host 110 coupled to memory device 120, whichincludes a memory array 130. Host 110 can be a host system such as apersonal laptop computer, a desktop computer, a digital camera, a mobiletelephone, or a memory card reader, among various other types of hosts.Host 110 can include a system motherboard and/or backplane and caninclude a number of processing resources (e.g., one or more processors,microprocessors, or some other type of controlling circuitry). Thesystem 100 can include separate integrated circuits or both the host 110and the memory device 120 can be on the same integrated circuit. Thesystem 100 can be, for instance, a server system and/or a highperformance computing (HPC) system and/or a portion thereof. Althoughthe example shown in FIG. 1 illustrates a system having a Von Neumannarchitecture, embodiments of the present disclosure can be implementedin non-Von Neumann architectures (e.g., a Turing machine), which may notinclude one or more components (e.g., CPU, ALU, etc.) often associatedwith a Von Neumann architecture.

For clarity, the system 100 has been simplified to focus on featureswith particular relevance to the present disclosure. The memory array130 can be a DRAM array, SRAM array, STT RAM array, PCRAM array, TRAMarray, RRAM array, NAND flash array, and/or NOR flash array, forinstance. The array 130 can comprise memory cells arranged in rowscoupled by access lines and columns coupled by sense lines (which may bereferred to herein as digit lines or data lines). Although a singlearray 130 is shown in FIG. 1, embodiments are not so limited. Forinstance, memory device 120 may include a number of arrays 130 (e.g., anumber of banks of DRAM cells). An example DRAM array is described inassociation with FIGS. 2A and 2B.

The memory device 120 includes address circuitry 142 to latch addresssignals provided over an I/O bus 156 (e.g., a data bus) through I/Ocircuitry 144. Address signals are received and decoded by a row decoder146 and a column decoder 152 to access the memory array 130. Data can beread from memory array 130 by sensing voltage and/or current changes onthe sense lines using sensing circuitry 150. The sensing circuitry 150can read and latch a page (e.g., row) of data from the memory array 130.The I/O circuitry 144 can be used for bi-directional data communicationwith host 110 over the I/O bus 156. The write circuitry 148 is used towrite data to the memory array 130.

Controller 140 decodes signals provided by control bus 154 from the host110. These signals can include chip enable signals, write enablesignals, and address latch signals that are used to control operationsperformed on the memory array 130, including data read, data write, anddata erase operations. In various embodiments, the controller 140 isresponsible for executing instructions from the host 110. The controller140 can be a state machine, a sequencer, or some other type ofcontroller.

An example of the sensing circuitry 150 is described further below inassociation with FIGS. 2A and 2B. For instance, in a number ofembodiments, the sensing circuitry 150 can include a number of sensingcomponents each of which can include a sense amplifier and/or a computecomponent. The sensing components may function as a latch serving as anaccumulator and/or may be used to perform logical operations (e.g., ondata associated with complementary sense lines). In a number ofembodiments, the sensing circuitry 150 can be used to perform operationsusing data stored in array 130 as inputs and store the results of theoperations back to the array 130 without transferring data via an I/Oline and/or via a sense line address access (e.g., without firing acolumn decode signal). As such, operations can be performed usingsensing circuitry 150 rather than and/or in addition to being performedby processing resources external to the sensing circuitry 150 (e.g., bya processor associated with host 110 and/or other processing circuitry,such as ALU circuitry, located on device 120 (e.g., on controller 140 orelsewhere)).

In various previous approaches, data associated with an operation, forinstance, would be read from memory via sensing circuitry and providedto an external ALU. The external ALU circuitry would perform theoperations using bit-vectors (which may be referred to as operands orinputs) and the result could be transferred back to the array via thelocal I/O lines. In contrast, in a number of embodiments of the presentdisclosure, sensing circuitry 150 is configured to selectively performan operation on data stored in memory cells in memory array 130 andstore the result back to the array 130 without activating a local I/Oline coupled to the sensing circuitry.

As such, in a number of embodiments, registers and/or an ALU external toarray 130 and sensing circuitry 150 may not be needed to perform theoperation as the sensing circuitry 150 can be operated to perform theappropriate computations involved in performing the operation.Additionally, the operation can be performed without the use of anexternal processing resource.

FIG. 2A is a schematic diagram illustrating sensing circuitry inaccordance with a number of embodiments of the present disclosure. Inthis example, the memory array 230 is a DRAM array of 1T1C (onetransistor one capacitor) memory cells each comprised of an accessdevice 202 (e.g., transistor) and a storage element 203 (e.g., acapacitor). In a number of embodiments, the memory cells may bedestructive read memory cells (e.g., reading the data stored in the celldestroys the data such that the data originally stored in the cell maybe refreshed after being read). The cells of the memory array 230 arearranged in rows coupled by word lines 204-0 (Row 0), 204-1 (Row 1),etc. and columns coupled by pairs of complementary data linesDIGIT(n−1)/DIGIT(n−1)_, DIGIT(n)/DIGIT(n)_, DIGIT(n+1)/DIGIT(n+1)_. Theindividual data lines corresponding to each pair of complementary datalines can also be referred to as data lines 205-1 (D) and 205-2 (D_)respectively. Although only three pair of complementary data lines areshown in FIG. 2A, embodiments of the present disclosure are not solimited, and an array of memory cells can include additional columns ofmemory cells and/or data lines (e.g., 4,096, 8,192, 16,384, etc.).

As shown in FIG. 2A, a gate of a particular memory cell transistor 202can be coupled to its corresponding word line 204-0, 204-1, . . . ,204-7, etc. A first source/drain region can be coupled to itscorresponding data line (e.g., 205-1 (D), 205-2 (D_)), and a secondsource/drain region of a particular memory cell transistor 202 can becoupled to its corresponding capacitor 203.

The memory array 230 is coupled to sensing circuitry 250 in accordancewith a number of embodiments of the present disclosure. In this example,the sensing circuitry 250 comprises a sense amplifier 206 correspondingto respective columns of memory cells (e.g., coupled to respective pairsof complementary data lines 205-1 (D) and 205-2 (D_)) but may, or maynot, additionally comprise a compute component. The sensing circuitrycan correspond to sensing circuitry 150 shown in FIG. 1, for example.

In the example illustrated in FIG. 2A, the sensing circuitry 250comprises a sense amplifier 206. An example configuration for senseamplifier 206 is described in detail with respect to FIG. 2B below. In anumber of embodiments, a sense amplifier 206 (e.g., “sense amp”) isprovided for each column of memory cells in an array (e.g., array 130).The sense amplifier 206 can be sense amplifier of a DRAM array, forinstance. In this example, sense amplifier 206 is coupled to a pair ofcomplementary data lines 205-1 (D) and 205-2 (D_). As such, the senseamplifier 206 can be coupled to all of the memory cells in a respectivecolumn through data lines 205-1 (D) and 205-2 (D_).

As shown in FIG. 2A, sensing circuitry 250 can be coupled to the memoryarray 230 via shift circuitry 223. In this example, the shift circuitry223 comprises a pair of isolation transistors 221-1 and 221-2 coupledintermediate within the data lines 205-1 (D) and 205-2 (D_). That is, afirst source/drain region of isolation transistor 221-1 can be coupledto a first portion of data line 205-1 (D) and a second source/drainregion of isolation transistor 221-1 can be coupled to a second portionof data line 205-1 (D). Isolation transistor 221-2 can be similarlycoupled between portions of data line 205-2 (D_).

Gates of the isolation transistors 221-1 and 221-2 are coupled to acontrol signal line 222 providing a normal configuration control signal(e.g., “NORM”) that, when activated, enables (e.g., turns on) theisolation transistors 221-1 and 221-2 to couple the corresponding senseamplifier 206 to a column of memory cells coupled to the pair ofcomplementary data lines 205-1 (D) and 205-2 (D_). According to variousembodiments, isolation transistors 221-1 and 221-2 coupling memory cellsto a particular sense amplifier 206 can be referred to as a “normal”configuration of the shift circuitry 223. Isolation transistors 221-1and 221-2 can be used when transferring data values to/from memory cellscoupled to data lines 205-1 (D) and 205-2 (D_) and the correspondingsense amplifier 206 (e.g., coupled to the date lines 205-1 (D) and 205-2(D_) via isolation transistors 221-1 and 221-2).

In the example illustrated in FIG. 2, the shift circuitry 223 alsoincludes another (e.g., a second) pair of isolation transistors 221-3and 221-4 coupled between a sense amplifier 206 and an adjacent pair ofcomplementary data lines 205-1 (D) and 205-2 (D_). As shown in FIG. 2,isolation transistors 221-3 and 221-4 are configured to couple the pairof complementary data lines 205-1 (D) and 205-2 (D_) (e.g.,DIGIT(n)/DIGIT(n)_ to an adjacent sense amplifier 206. Isolationtransistors 221-3 and 221-4 may also be described as being configured tocouple a sense amplifier 206 (e.g., corresponding to the pair ofcomplementary data lines 205-1 (D) and 205-2 (D_) such asDIGIT(n)/DIGIT(n)_) to an adjacent pair of complementary data lines205-1 (D) and 205-2 (D_)) (e.g., DIGIT(n−1)/DIGIT(n−1)_).

Isolation transistors 221-3 and 221-4 are configured to couple theadjacent pair of complementary data lines from one side of isolationtransistors 221-1 and 221-2 (e.g., a portion of the adjacent pair ofcomplementary data lines 205-1 (D) and 205-2 to which memory cells arecoupled) to an opposite side of isolation transistors 221-1 and 221-2 ofa different shift circuitry 223 coupled to the pair of complementarydata lines 205-1 (D) and 205-2 (e.g., a portion of the pair ofcomplementary data lines 205-1 (D) and 205-2 to which sense amplifier206 is coupled). For example, isolation transistors 221-3 and 221-4couple data lines Digit(n) and Digit (n)_ on the memory array 230 sideof isolation transistors 221-1 and 221-2 to the sense amplifier 206corresponding to data lines Digit(n+1) and Digit (n+1)_ (e.g., theright-most sense amplifier 206 shown in FIG. 2A). The gates of isolationtransistors 221-3 and 221-4 can be coupled to a control signal line 219providing a shift control signal (e.g., “SHIFT”), which can beactivated, for example, when the NORM control signal 222 is deactivated.

This configuration facilitates shifting data right or left. To shiftdata right for example, data from memory cell coupled to data linesDigit(n) and Digit (n)_ can be communicated to the right-most senseamplifier 206 shown in FIG. 2 by turning-on shift isolation transistors221-3 and 221-4 between the right-most sense amplifier 206 shown in FIG.2 and data lines Digit(n+1) and Digit (n+1)_. The normal isolationtransistors 221-1 and 221-2 between the center sense amplifier 206 shownin FIG. 2 and data lines Digit(n) and Digit (n)_ are turned-off, and thenormal isolation transistors between the right-most sense amplifier 206shown in FIG. 2 and data lines Digit(n+1) and Digit (n+1)_ are alsoturned-off. Firing the right-most sense amplifier shown in FIG. 2A canload the data from data lines Digit (n) and Digit (n)_ into theright-most sense amplifier shown in FIG. 2A.

This right-shifted data can subsequently be transferred to memory cellscoupled to data lines Digit(n+1) and Digit (n+1)_ by turning-off shiftisolation transistors 221-3 and 221-4 and turning-on the normalisolation transistors between the right-most sense amplifier shown inFIG. 2A and data lines Digit(n+1) and Digit (n+1)_.

To shift data left for example, data from a memory cell coupled to datalines Digit(n) and Digit (n)_ can first be communicated to the centersense amplifier 206 shown in FIG. 2 by turning-on the normal isolationtransistors 221-1 and 221-2 between the center sense amplifier 206 shownin FIG. 2A and data lines Digit(n) and Digit (n)_, and subsequentlyfiring the center sense amplifier 206 shown in FIG. 2 to load the datainto the center sense amplifier 206 shown in FIG. 2A. The normalisolation transistors 221-1 and 221-2 between the center sense amplifier206 shown in FIG. 2A and data lines Digit(n) and Digit (n)_ can beturned-off, and the shift isolation transistors between the center senseamplifier 206 shown in FIG. 2A and data lines Digit(n−1) and Digit(n−1)_ can be turned-on (with the normal isolation transistors betweenthe left-most sense amplifier 206 shown in FIG. 2A and data linesDigit(n−1) and Digit (n−1)_ being turned-off). Data from the centersense amplifier 206 shown in FIG. 2A can be loaded into memory cellscoupled to data lines Digit(n−1) and Digit (n−1)_ by enabling a desiredrow of memory cell coupled to data lines Digit(n−1) and Digit (n−1)_.

Although shift circuitry 223 shown in FIG. 2A is configured such thatisolation transistors 221-3 and 221-4 couple a pair of complementarydata lines 205-1 (D) and 205 (D_) to a right adjacent sense amplifier206 (e.g., or coupled sense amplifier to a left adjacent pair ofcomplementary data lines 205-1 (D) and 205-2 (D_)), embodiments of thepresent disclosure are not limited to the particular configurationillustrated in FIG. 2A. For instance, isolation transistors 221-3 and221-4 can be configured to couple a pair of complementary data lines205-1 (D) and 205-2 (D_) to a left adjacent sense amplifier 206 (e.g.,or coupled a sense amplifier to a right adjacent pair of complementarydata lines 205-1 (D) and 205 (D_)). In some embodiments, isolationtransistors 221-3 and 221-4 can be configured to couple a pair ofcomplementary data lines 205-1 (D) and 205-2 (D_) to a sense amplifier206 that is non-adjacent (e.g., a different sense amplifier2 than towhich isolation transistors 221-1 and 221-2 couple the pair ofcomplementary data lines 205-1 (D) and 205-2 (D_)).

The shift circuitry 223 is effectively configured as a 2-to-1multiplexer being able to couple a compute component 250 to one of twopossible data line configurations (e.g., normal coupling to acorresponding pair of complementary data lines via a first pair ofisolation transistors and shift coupling to an adjacent pair ofcomplementary data lines via a second pair of isolation transistors).

Embodiments of the present disclosure are not limited to theconfiguration of shift circuitry 223 shown in FIG. 2A. In a number ofembodiments, shift circuitry 223 such as that shown in FIG. 2A can beoperated (e.g., in conjunction with sense amplifiers 206) in associationwith performing compute functions such as adding and subtractingfunctions without transferring data out of the sensing circuitry via anI/O line (e.g., local IO/IO_ lines), for instance.

Each column of memory cells can be coupled to a column decode line thatcan be enabled to transfer, via local I/O line, a data value from acorresponding sense amplifier 206 to a control component external to thearray such as an external processing resource (e.g., host processorand/or other functional unit circuitry). For example, data lines 205-1(D) and 205-2 (D_) can be coupled to respective local I/O lines that areresponsive to an enabling signal to access transistors to perform anoperation such as a data line access in association with a readoperation. Such an enabling signal can be activated to transfer a signalcorresponding to the state (e.g., a logic data value such as logic “0”or logic “1”) of the memory cell being accessed out of the array on anI/O line to a secondary sense amplifier (SSA) and/or elsewhere off-pitchfrom the array 230.

Also, the column decode line can be coupled to a column decoder (e.g.,column decoder 152 shown in FIG. 1). However, as described herein, in anumber of embodiments, data need not be transferred via such I/O linesto perform logical operations in accordance with embodiments of thepresent disclosure. In a number of embodiments, shift circuitry 223 suchas that shown in FIG. 2A can be operated (e.g., in conjunction withsense amplifiers 206) in performing compute functions such as adding andsubtracting functions without transferring data to a control componentexternal to the array, for instance.

The sense amplifier 206 can be operated to determine a data value (e.g.,logic state) stored in a selected memory cell and/or represented by thevoltages present on the complementary data lines 205-1 (D), 205-2 (D_).The sense amplifier 206 can also be utilizing in conjunction with thememory array 230 to perform operations, as is described with respect toFIG. 3.

Embodiments of sense amplifier 206 are not limited to the example shownin FIG. 2A. Sense amplifier 206 can be for example, a current-mode senseamplifier and/or single-ended sense amplifier (e.g., sense amplifiercoupled to one data line). Also, embodiments of the present disclosureare not limited to a folded data line architecture. In a number ofembodiments, the sense amplifier 206 can be operated to perform alogical operation using the equilibration circuitry, and/or inconjunction with invert circuitry, with the result being stored in aprimary latch without transferring data from the sensing circuitry viaan I/O line (e.g., without performing a data line address access viaactivation of a column decode signal, for instance).

FIG. 2B illustrates a schematic diagram of a portion of sensingcircuitry in accordance with a number of embodiments of the presentdisclosure. In various embodiments, sense amplifier 206 can comprise across coupled latch. However, embodiments of the sense amplifier 206 arenot limited to a cross coupled latch. As an example, the sense amplifier206 in FIG. 2B can be a current-mode sense amplifier and/or asingle-ended sense amplifier (e.g., sense amplifier coupled to one dataline). Also, embodiments of the present disclosure are not limited to afolded data line architecture.

In a number of embodiments, a sense amplifier (e.g., 206) can comprise anumber of transistors formed on pitch with the transistors of thecorresponding compute component 231 and/or the memory cells of an array(e.g., 230 shown in FIG. 2A) to which they are coupled, which mayconform to a particular feature size (e.g., 4F², 6F², etc.). Senseamplifier 206 comprises a latch 215 including four transistors coupledto a pair of complementary data lines D 205-1 and D_ 205-2. The latch215 can be a cross coupled latch. That is, the gates of a pair oftransistors, such as n-channel transistors (e.g., NMOS transistors)227-1 and 227-2 are cross coupled with the gates of another pair oftransistors, such as p-channel transistors (e.g., PMOS transistors)229-1 and 229-2. As described further herein, the latch 215 comprisingtransistors 227-1, 227-2, 229-1, and 229-2 can be referred to as aprimary latch. However, embodiments are not limited to this example.

The voltages and/or currents on the respective data lines D and D_ canbe provided to the respective latch inputs 233-1 and 233-2 (e.g., nodes)of the cross coupled latch 215 (e.g., the input of the primary latch).In this example, the latch input 233-1 is coupled to a firstsource/drain region of transistors 227-1 and 229-1 as well as to thegates of transistors 227-2 and 229-2. Similarly, the latch input 233-2can be coupled to a first source/drain region of transistors 227-2 and229-2 as well as to the gates of transistors 227-1 and 229-1. Thecompute component 231, which may be referred to herein as anaccumulator, can be coupled to latch inputs 233-1 and 233-2 of the crosscoupled latch 215 as shown; however, embodiments are not limited to theexample shown in FIG. 2B.

In this example, a second source/drain region of transistor 227-1 and227-2 is commonly coupled to an RnIF 228. A second source/drain regionof transistors 229-1 and 229-2 is commonly coupled to an ACT signal 207.The ACT signal 207 can be a supply voltage 234 (e.g., V_(DD)) and theRnIF signal 228 can be a reference voltage (e.g., ground). Activatingsignals 228 and 207 enables the cross coupled latch 215. The latch 215can also include a pair of cross coupled p-channel transistors (e.g.,PMOS transistors) 229-1 and 229-2 having their respective sourcesselectively coupled to a supply voltage 234 e (e.g., V_(DD)) through asource transistor 211. Source transistor 211 can be a p-channeltransistor (e.g., PMOS transistor), for example. A gate of the sourcetransistor 211 can be coupled to a positive control signal lineproviding a positive control signal 207 (e.g., ACT). Cross coupledp-channel transistor 229-1 can have a drain directly coupled to latchinput 233-1, and cross coupled p-channel transistor 629-2 can have adrain directly coupled to latch input 233-2.

The enabled cross coupled latch 215 operates to amplify a differentialvoltage between latch input 233-1 (e.g., first common node) and latchinput 233-2 (e.g., second common node) such that latch input 233-1 isdriven to one of the ACT signal voltage and the RnIF signal voltage(e.g., to one of V_(DD) and ground), and latch input 233-2 is driven tothe other of the ACT signal voltage and the RnIF signal voltage.

The sense amplifier 206 can also include circuitry configured toequilibrate the data lines D and D_ (e.g., in association with preparingthe sense amplifier for a sensing operation). In this example, theequilibration circuitry 214 comprises a transistor 224 having a firstsource/drain region coupled to a first source/drain region of transistor225-1 and data line D 205-1. A second source/drain region of transistor224 can be coupled to a first source/drain region of transistor 225-2and data line D_ 205-2. A gate of transistor 224 can be coupled to gatesof transistors 225-1 and 225-2.

The second source drain regions of transistors 225-1 and 225-2 arecoupled to an equilibration voltage 238 (e.g., V_(DD)/2), which can beequal to V_(DD)/2, where V_(DD) is a supply voltage associated with thearray. The gates of transistors 224, 225-1, and 225-2 can be coupled tocontrol signal 226 (EQ). As such, activating EQ enables the transistors224, 225-1, and 225-2, which effectively shorts data line D to data lineD_ such that the data lines D and D_ are equilibrated to equilibrationvoltage V_(DD)/2. Alternatively, activation of an ACT equilibratetransistor 216 in response to an ACTEQ signal 218 will short the sourceregions for cross coupled p-channel transistors 629-1 and 629-2 to theequilibrate voltage (e.g., Vdd/2) 220. According to a number ofembodiments of the present disclosure, a number of logical operationscan be performed using the sense amplifier 206 and compute component231, and the result can be stored in the sense amplifier and/or computecomponent.

The sense amplifier 206 can include circuitry configured to invert thedata stored latch 215. Sense amplifier 206 comprises invert circuitry241 including four transistors 243-1, 243-2, 245-1, and 245-2 coupled toa pair of complementary data lines D 205-1 and D 205-2. Transistors243-1 and 243-2 can be isolation transistors having their gates coupledto isolation line 247. Transistor 245-1 and 245-2 can be inverttransistors having their gates coupled to a source/drain region oftransistors 243-1 and 243-2.

The sensing circuitry 250 in FIGS. 2A and 2B can be operated in severalmodes to perform logical operations, including a first mode in which aresult of the logical operation is initially stored in the senseamplifier 206, and a second mode in which a result of the logicaloperation is initially stored in the compute component 231. Additionallywith respect to the first operating mode, sensing circuitry 250-2 can beoperated in both pre-sensing (e.g., sense amplifiers fired beforelogical operation control signal active) and post-sensing (e.g., senseamplifiers fired after logical operation control signal active) modeswith a result of a logical operation being initially stored in the senseamplifier 206.

As described further below, the sense amplifier 206 can, in conjunctionwith the compute component 231, be operated to perform various logicaloperations using data from an array as input. In a number ofembodiments, the result of a logical operation can be stored back to thearray without transferring the data via a data line address access(e.g., without firing a column decode signal such that data istransferred to circuitry external to the array and sensing circuitry vialocal I/O lines). As such, a number of embodiments of the presentdisclosure can enable performing various operations (e.g., logicaloperations, mathematical operations, etc.) using less power than variousprevious approaches. Additionally, since a number of embodimentseliminate the need to transfer data across I/O lines in order to performoperations (e.g., between memory and discrete processor), a number ofembodiments can enable an increased parallel processing capability ascompared to previous approaches.

FIG. 3 illustrates a timing diagram associated with initiating an ANDlogical operation and inverting the result of the AND logical operationusing the sense amplifier 206 shown in FIG. 2. The invert circuitry 241in FIG. 2B can be used to invert signals stored in a latch. The latchcan be the cross-coupled latch in FIG. 2B, among other types of latches.The example illustrated in FIG. 3 is one example of inverting signalsstored in a latch, such as latch 215 in FIG. 2B. FIG. 3 shows signalsfor various rows Rows 1, 3 (operated together in this example), 4, and 5and control lines ISO and INV. However, implementation of the presentmethodology is not limited to operation of these particular rows andcontrol lines and can be implemented using different rows and controllines. The particular timing diagram signals are discussed below withrespect to the pseudo code associated with inverting the results of anAND operation of the circuit shown in FIGS. 2A and 2B.

An example of pseudo code associated with inverting the results an ANDlogical operation is summarized below. In this example, the pseudo codebelow directs an AND operation involving a data value stored in a memorycell coupled to Row 4 with a data value stored in a memory cell coupledto Row 5 (e.g., Row 4 AND Row 5) and an invert of the result of the ANDoperation. However, using operands for the logical AND operation fromRows 4 and 5 are merely one example, and the present disclosure is notconfined to performing logical operations on operands from only theserows (e.g., data values stored in memory cells from other rows in amemory array can be used as operands for logical operations). Logicaloperations can be implemented using other rows than those used in theexample illustration below.

Copy Row 4 into Row 1 and Row 3

-   -   Deactivate EQ    -   Sense amplifier deactivated (e.g., ACT is high, RnIF is low)    -   ACTEQ signal deactivated    -   Open Row 4    -   Fire Sense Amplifier (e.g., activate control signals ACT and        RnIF in the sense amplifier-after which Row 4 data resides in        the sense amplifier)    -   Close Row 4    -   Activate ACTEQ signal    -   Open Row 1 and Row 3    -   Close Rows 1 and 3    -   Precharge (e.g., deactivate control signals ACT and RnIF in the        sense amplifier-activate EQ (t₄))

AND Row 4 with Row 5

-   -   Deactivate EQ    -   Deactivate ACTEQ signal    -   Open Row 1 and Row 3    -   Close Row 1 and Row 3    -   Open Row 5    -   Fire Sense Amplifier        Invert result of AND operation    -   Activate ISO and INV    -   Deactivate ISO    -   Deactivate INV    -   Activate INV    -   Activate ISO    -   Close Row 5 (or 6)    -   Activate ACTEQ    -   Precharge

In the pseudo code above, “Deactivate EQ” indicates that anequilibration circuitry corresponding to the sense amplifier 206 shownin FIG. 2 is deactivated prior to t₁ shown in FIG. 3. Also shown is that“ACTEQ” signal is high decoupling the equilibration voltage signal(V_(DD)/2) from the source regions of p-channel transistors 229-1 and229-2 prior to t₁ shown in FIG. 3. As was described with respect toequilibration circuitry 214 for sense amplifier 206 shown in FIGS. 2Aand 2B, deactivation of the equilibration circuitry 214 occurs byequilibration signals EQ on control signal line 226 going low toturn-off transistors 225-1, 225-2, and 224 such that data lines 205-1(D) and 205-2 (D_) are not shorted together and to an equilibrationvoltage (e.g., V_(DD)/2). Deactivation of the ACTEQ signal occurs byACTEQ signal 218 going high to turn-off an ACTEQ equilibrationtransistor such that the source regions for p-channel transistors 229-1and 229-2 are not shorted together and to an equilibration voltage(e.g., V_(DD)/2).

After the equilibration circuitry 214 is deactivated, and the ACTEQequilibration transistor is deactivated, a selected row (e.g., Row 4) isenabled as indicated by “Open Row 4” in the pseudo code and as shown att₁ for signal Row 4 in FIG. 3. When the voltage signal applied to Row 4(e.g., 204-4 shown in FIG. 2) reaches the threshold voltage (Vt) of theaccess transistor corresponding to the selected cell, the accesstransistor turns on and couples the data line (e.g., 205-2 (D_)) to theselected cell which creates a differential voltage signal between thedata lines. Typical word line voltage for a row can be, for example, 3.6V when the power supply (e.g., V_(DD)) is 1.2 V. That is, word lineactivation voltage can be three (3) times the power supply voltage, forinstance. Voltage above V_(DD) can be implemented, for example, usingcharge pump circuitry. FIG. 3 shows the voltage on data line D risingslightly from the equilibration voltage level (e.g., V_(DD)/2=1.2V/2=0.6V) to indicate a logic “1” being stored in the memory cell coupled toRow 4.

After Row 4 is opened, in the pseudo code above, “Fire Sense amplifier”indicates that the sense amplifier 206 is enabled, as also shown at t₁in FIG. 3. Firing the sense amplifier 206 loads the Row 4 data valueinto the sense amplifier. The sense amplifier 206 can be enabled asdescribed with respect to sense amplifier 206 shown in FIGS. 2A and 2B,for example, by the ACT positive control signal going low and the RnIFnegative control signal going high, which amplifies the differentialsignal between 205-1 (D) and D_ 205-2, resulting in a voltagecorresponding to a logic “1” (e.g., V_(DD)) or a voltage correspondingto a logic “0” (e.g., GND) being on data line 205-1 (D) (and the voltagecorresponding to the other logic state being on complementary data line205-2 (D_)). FIG. 3 shows the voltage on data line D rising to V_(DD)(e.g., 1.2 V) to indicate a logic “1” being stored in the memory cellcoupled to Row 4, for example. The sensed data value (e.g., Row 4) isstored in the primary latch of sense amplifier 206. The primary energyconsumption occurs in charging the data lines (e.g., 205-1 (D) or 205-2(D_)) from the equilibration voltage V_(DD)/2 to the rail voltageV_(DD).

After firing the sense amplifiers, Row 4 is then closed as shown in thepseudo code above. At this time the ACTEQ signal 218 is activated toshort the source regions of p-channel transistors 229-1 and 229-2together and couple them to an equilibrate voltage 220 (V_(DD)/2). AnACTEQ equilibration transistor can be a p-channel transistor such thatthe ACTEQ equilibration transistor is activated by the ACTEQ signal 218going low. Likewise the ACT signal is deactivated, going high as shownin FIG. 3.

While the ACTEQ signal remains activated, selected rows (e.g., Rows 1and 3) are enabled as indicated by “Open Row 1 and Row 3” in the pseudocode and as shown at t₂ for signal Rows 1 and 3 in FIG. 3. Rows 1 and 3are opened in a similar manner as that previously described with respectto opening Row 4. Opening Rows 1 and 3 stores the data value stored inthe primary latch of the sense amplifier 206 (e.g., from Row 4) tomemory cells coupled to Rows 1 and 3. If the data value is a logic “0”,0.0 Volts is stored to the memory cells of Rows 1 and 3. If the datavalue is a logic “1”, the equilibrated voltage (e.g., 0.6 Volts) isstored to the memory cells of Rows 1 and 3 instead of a typical 1.0 ormore voltage.

After the data value from Row 4 is stored into Rows 1 and 3, Rows 1 and3 are deactivated as indicated by “Close Rows 1 and 3” and as indicatedat t₃ in FIG. 3 for the Rows 1 and 3 signals. Closing rows can beaccomplished by turning off the access transistor to decouple theselected cell from the corresponding data line.

After all rows 1 and 3 are closed, and while the ACTEQ signal remainsactivated, “Precharge” in the pseudo code above can cause a precharge ofthe data lines by an equilibrate operation, as shown in FIG. 3 at t₄.The equilibration operation can be initiated by the EQ control signal(on the equilibration control signal line 226 shown in FIGS. 2A and 2B)going high to turn on all transistors 225-1, 225-1, and 224 so as toshort data lines 205-1 (D) and 205-2 (D_) together and to anequilibration voltage (e.g., V_(DD)/2). This clears the Row 4 data valuefrom the data line 205-2 (D_) shown in FIG. 2B. The precharge is shownin FIG. 3 by the voltages on the data line D_returning from the rail tothe equilibration voltage (e.g., 0.6 V).

In the pseudo code above, “Deactivate EQ” indicates that anequilibration circuitry corresponding to the sense amplifier 206 shownin FIG. 2B is deactivated as previously described above, and as shown att₅ in FIG. 3. Additionally, in the pseudo code above, “Deactivate ACTEQ”indicates that ACTEQ equilibration transistor also returns to a highACTEQ signal to turn off the ACTEQ equilibration transistor anddecoupling the source regions of p-channel transistors 229-1 and 229-2in the sense amplifier 206 from an equilibration voltage (e.g.,V_(DD)/2).

With the data lines D and D_ and the source regions of p-channeltransistors 229-1 and 229-2 in the sense amplifier 206 equilibrated, Row1 and Row 3 are opened again, as indicated by “Open Row 1 and Row 3” inthe pseudo code and as shown at t₆ for signal Rows 1 and 3 in FIG. 3.Rows 1 and 3 are opened in a similar manner as that previously described(e.g., with 3.6V applied), as is shown at t₆ for signal Rows 1 and 3 inFIG. 3.

Opening the rows where the first operand of the AND logical operation(e.g., Row 4) data value was previously stored, and having the sourceregions of p-channel transistors 229-1 and 229-2 in the sense amplifier206 equilibrated, results in the charge stored in the memory cellscoupled to Rows 1 and 3 having no effect on the data line voltages(e.g., at equilibrate voltage) when the Row 4 data value stored in Rows1 and 3 corresponds to a logic “1” because the logic “1” stored in Rows1 and 3 is at substantially the same voltage as that to which the dataline is equilibrated (e.g., 0.6V).

In contrast, however, opening Rows 1 and 3, having the source regions ofp-channel transistors 229-1 and 229-2 in the sense amplifier 206equilibrated, causes the access transistor for the memory cell coupledto Row 1 and the access transistor for the memory cell coupled to Row 3to turn-on when the Row 4 data value corresponds to a logic “0” (whichwas previously stored in Rows 1 and 3). If a logic “0” is stored in thememory cell, the memory cell is discharged (e.g., 0 V). Therefore, withthe word line being charged to 3.6V, the Vgs of the access device is 3.6V−0 V=3.6 V, which is above the Vt for the access transistor itturns-on. Turning on the access transistors for the memory cells coupledto Rows 1 and 3 causes the data line voltage to decrease below theequilibrate voltage. The voltage drop is caused by the storage elementsfor the memory cells of Row 1 and 3 being charged by the equilibrationvoltage on data line, which decreases the resulting voltage of the dataline D_. Effectively, the voltage on data line D_ is decreased by theeffect of 2 logic zeros.

In the pseudo code above, “Close Row 1 and Row 3” indicates that Rows 1and 3 are deactivated as previously described above for rows 1 and 3,and as shown in FIG. 3 at t₇. According to some embodiments of thepresent disclosure, any row coupled to the data lines is cancelled byclosing the corresponding row line prior to opening the row to which amemory cell storing the second operand of the logical operation isstored, as described immediately below.

The row storing the second operand of the logical operation (e.g., Row5) is enabled as indicated by “Open Row 5” in the pseudo code and asshown at t₈ for signal Row 5 in FIG. 3. Row 5 is opened in the samemanner previously described for opening Row 3. If the Row 4 data valuewas a logic “1,” normal sensing of the data value of Row 5 occurs.Recall, when the first operand of the AND logical operation is a logic“1,” the data line remains at the equilibration voltage when Rows 1 and3 are opened, as described above. Maintaining the data lines at theequilibration voltage enables the second operand of the AND logicaloperation to be sensed normally.

When the first operand of an AND logical operation is a logic “1,” theresult of the AND logical operation follows the value of the secondoperand so that if the second operand is a logic “0” the result of theAND logical operation is also a logic “0,” and if the second operand isa logic “1” the result of the AND logical operation is also a logic “1.”That is, when the first operand of an AND logical operation is a logic“1,” the sensed data value for the second operand is also the result ofthe AND logical operation. The data line voltages show in FIG. 3illustrate the first and second operands of the AND logical operationbeing logic “1.” With Row 5 open, firing the sense amplifier drives thelogic “1” voltage on the data lines to the rails, and thereby stores theresult of the AND logical operation in the Row 5 memory cell, as shownafter t₈ in FIG. 3 before Row 5 closes.

By contrast, if the Row 4 data value was a logic “0,” then the result ofthe AND logical operation will be a logic “0” regardless of the logicstate of the Row 5 data value. Recall the discussion above when Row 1and Row 3 are opened after the Row 4 data value was stored therein, whenthe Row 4 data value is a logic “0,” the data line voltage is decreasedfrom the equilibrate voltage by the effect of two zeros (e.g., one ineach of two memory cells, one coupled to each of Row 1 and Row 3).Therefore, the Row 5 data value is not sensed with the data lineinitially being at the equilibration voltage, but rather with the dataline initially being below the equilibration voltage (e.g., by two logic“0” lack-of-charges).

Because of the depressed initial data line voltage for sensing the Row 5data value, if the Row 4 data value was a logic “0,” then sensing Row 5always results in a logic “0” being sensed, regardless of what datavalue was stored in Row 5. If the Row 5 data value is a logic “1,” thevoltage on the data line will reflect the equilibrate voltage less twologic “0” data values (from Rows 1 and 3) plus the charge of the Row 5logic “1.” The net result is that the data line will reflect theequilibrate voltage minus one “0” data value. The Row 5 “1” data valueeffectively cancels out one of the “0” data values from Rows 1 and 3leaving one “0” data value from Rows 1 and 3 still modifying the voltageon the data line. A logic “0” will be sensed when the sense amp 206fires since the data line voltage is below the equilibrate voltage atsensing.

If the Row 5 data value is a logic “0,” the voltage on the data linewill be decreased even further from the initial voltage below theequilibrate voltage caused by the Row 1 and 3 data values. That is, thedata line voltage will correspond to the equilibration voltage minusthree data values of logic “0.” Again, a logic “0” will be sensed whenthe sense amp 206 fires since the data line voltage is well below theequilibrate voltage at sensing.

As shown in FIG. 2A, the memory cell corresponding to Row 5 is coupledto data line D, as was the memory cells of Rows 1 and 3. However, theAND logical operation of the circuitry shown in FIG. 2 provides acorrect result of the AND logical operation even if the second operandof the AND logical function is stored in an even Row (the memory cellsof even rows being coupled to the complementary data line D_) where thecharge in the memory cell storing the second operand will not affectdata line D.

For example, if the second operand was stored in a memory cell coupledto Row 6, the Row 6 data value is sensed normally when the first operandof the AND logical operation (e.g., Row 4) is a logic “1,” and the datalines remain at the equilibration voltage when Rows 1 and 3 are opened,as previously described.

If the first operand of the AND logical operation (e.g., Row 4) is alogic “0,” the data line D voltage is depressed from the equilibrationvoltage when Rows 1 and 3 are opened, as described above. If the Row 6data value is a logic “1,” data line D_ reflects a voltage correspondingto the logic “1” when Row 6 is opened (e.g., greater than the initialequilibration voltage for data line D_ before Row 6 is opened), and dataline D is charged to the equilibration voltage less the voltage decreasecaused by the two logic “0” data values from Rows 1 and 3. Therefore,the sense amplifier 206 (when fired) compares the voltage on data line D(e.g., V_(DD)/2 minus the effect of two logic “0” data values from Rows1 and 3) to the voltage on data line D_ (e.g., V_(DD)/2 plus the effectof one logic “1” data value from Row 6), resulting in a logic “0” beingsensed (and stored into a memory cell coupled to Row 6).

If the Row 6 data value is a logic “0,” data line D_ reflects a voltagecorresponding to the logic “0” when Row 6 is opened (e.g., voltage belowthe equilibrate voltage by the effect of one logic “0” from Row 6), anddata line D has a voltage equal to the equilibration voltage less thevoltage decrease caused by the two logic “0” data values from Rows 1 and3. Therefore, the sense amplifier 206 (when fired) compares the voltageon data line D (e.g., V_(DD)/2 minus the effect of two logic “0” datavalues from Rows 1 and 3) to the voltage on data line D_ (e.g., V_(DD)/2minus the effect of one logic “0” data value from Row 6), resultingagain in a logic “0” being sensed since data line D is at a lowervoltage than data line D_. The appropriate AND logical operation resultof a logic “0” (at least from the first operand being a logic “0”)occurs, and is stored into a memory cell coupled to Row 6.

An invert operation can be performed on the result of the AND logicaloperation stored in the sense amplifier 206. The ISO and INV controllines can be activated to enable isolation transistors 243-1 and 243-2and invert transistors 245-1 and 245-2. Enabling isolation transistors243-1 and 243-2 and invert transistors 245-1 and 245-2 can cause thesignals from nodes 233-1 and 233-2 in latch 215 to be transferred totransistors 245-1 and 245-2, respectively. At t₉, the ISO control linecan be deactivated causing the signals from nodes 233-1 and 233-2 inlatch 215 to be stored to transistors 245-1 and 245-2, respectively. Att₁₀, the INV control line can be deactivated causing the data linecoupled to transistor 245-1 to be pulled down which inverts the signalsstored in latch 215. At t₁₁, the INV control line can be activated afterthe signals stored in latch 215 have been inverted. At t₁₂, the ISOcontrol line can be activated causing the inverted signals on latch 215to be transferred to transistors 245-1 and 245-2. These inverted signalscan be stored in memory cells and/or transferred to compute component231 for further processing.

After the sense amplifier fires as described for the various scenariosdiscussed above, thereby storing the inverted result of the AND logicaloperation into the memory cell within which the second operand of theAND logical operation was previously stored, the Row 5 (or 6) is closedin a manner previously described above for other rows, as indicated inthe pseudo code and as show in FIG. 3 at t_ for signal Row 5. At t₁₃,the sense amplifier is deactivated and the ACTEQ equilibrationtransistor is activated by the ACTEQ signal 618 going low. A precharge(e.g., equilibration operation) is also initiated as previouslydescribed, as indicated in the pseudo code and shown at t₁₄ in FIG. 3.

While example embodiments including various combinations andconfigurations of sensing circuitry, sense amplifiers, memory cells of amemory array coupled to particular rows, invert circuitry, and/or shiftcircuitry have been illustrated and described herein, embodiments of thepresent disclosure are not limited to those combinations explicitlyrecited herein. Other combinations and configurations of the sensingcircuitry, sense amplifiers, memory cells, invert circuitry, and/orshift circuitry disclosed herein are expressly included within the scopeof this disclosure.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of one or more embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the one or moreembodiments of the present disclosure includes other applications inwhich the above structures and methods are used. Therefore, the scope ofone or more embodiments of the present disclosure should be determinedwith reference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. A system, comprising: a host configured togenerate instructions; a memory device coupled to the host andcomprising an array of memory cells configured to store operands; andcontrol circuitry configured to execute instructions from the host, theexecution including: causing performance of a logical operation onoperands stored in memory cells corresponding to a same column of thearray and coupled to different access lines of the array, whereinperforming the logical operation includes storing a data valuecorresponding to a result of the logical operation in a latch of asensing component coupled to the array and corresponding to the samecolumn; and causing inversion of the data value stored in the latch viaoperation of invert circuitry coupled to the latch; and wherein thelogical operation is performed without transferring the operandsexternal to the array and the latch via an input/output (I/O) line. 2.The system of claim 1, wherein the host comprises a processing resourceconfigured to generate the instructions.
 3. The system of claim 2,wherein the processing resource comprises a host processor.
 4. Thesystem of claim 2, wherein the processing resource comprises acontroller.
 5. The system of claim 1, wherein the control circuitrycomprises a state machine.
 6. The system of claim 1, wherein the controlcircuitry comprises a sequencer.
 7. The system of claim 1, wherein thecontrol circuitry comprises shift circuitry configured to controlshifting data in the array.
 8. The system of claim 1, wherein the hostcomprises a processor, and wherein the processor is on a separateintegrated circuit from an integrated circuit on which the memory deviceis located.
 9. The system of claim 1, wherein the host and the memorydevice are on a same integrated circuit.
 10. The system of claim 1,wherein the host comprises a processing resource configured to performlogical operations in addition to those logical operations performed onthe memory device.
 11. The system of claim 1, further comprising acontrol bus configured to provide signals from the host to be decoded bythe control circuitry.
 12. The system of claim 1, wherein execution ofthe instructions from the host further comprises transferring theinverted data value from the latch to a compute component to which thelatch is coupled.
 13. The system of claim 1, wherein execution of theinstructions from the host further comprises transferring the inverteddata value from the latch to an external processing component forfurther processing.
 14. The system of claim 13, wherein the externalprocessing component comprises a host processor.
 15. A systemcomprising; a host configured to generate instructions; a memory devicecoupled to the host and comprising an array of memory cells configuredto store operands; and control circuitry configured to executeinstructions from the host by causing: logical operations to beperformed on operands stored in memory cells of the array, result of thelogical operations being stored in respective sense amplifier latchescoupled to the array; inversion, in parallel, of respective data valuesstored in the respective sense amplifier latches and corresponding torespective logical operation results; and transfer of the respectiveinverted data values from the respective sense amplifier latches to anexternal processing resource; and wherein the logical operations areperformed without transferring the operands to an external processingresource.
 16. The system of claim 15, wherein the external processingresource comprises a processor of the host.
 17. The system of claim 15,wherein the control circuitry is internal to the memory device and isconfigured to receive control signals from the host via a bus.
 18. Amethod, comprising: generating instructions on a host coupled to amemory device comprising an array of memory cells configured to storeoperands; executing the instructions using control circuitry of thememory device, wherein executing the instructions comprises: causingperformance of logical operations on operands stored in the array;inverting, in parallel, respective data values stored in respectivesense amplifier latches and corresponding to respective logicaloperation results; and transferring respective inverted data values fromthe respective sense amplifier latches to an external processingresource; and performing the logical operations without transferring theoperands to an external processing resource.
 19. The method of claim 18,further comprising providing the instructions from the host to thecontrol circuitry via a control bus.
 20. The method of claim 18, furthercomprising using input/output (I/O) circuitry for bi-directional datacommunication between the host and the memory device over an I/O bus.